Quality System
Full-process control · Digital quality traceability · Reliability validation
Built on an ISO quality management system, UDD operates IQC, IPQC and FQC final inspection plus OQC outgoing controls across the whole process, with ERP/MES digital systems enabling batch-level quality traceability, delivering consistent and reliable mass production for consumer electronics, automotive and medical customers.
Quality Control System
IQC/IPQC/FQC/OQC gates span the full flow — first-article approval, in-process patrol, final inspection and outgoing sampling secure mass-production consistency.
Digital Traceability
ERP/MES covers the whole production flow; batch data is traceable, letting issues be located fast and closed out.
Molding Quality
Dimensional inspection · Environmental reliability tests · Batch traceability
Full-process control spans raw material incoming inspection, injection molding, spray coating and final shipment; quality management strictly governs process and cosmetic performance, standardizes defective sorting, and enforces sample retention and batch traceability to prevent any nonconforming product from escaping.
Precision Inspection
CMM and vision measurement cover mold components, cores/cavities and molded parts — key dimensions are 100% verified, with provable accuracy.
Injection Process Control
First-article approval, in-process patrol and batch traceability secure consistent, low-defect delivery of two-shot, thin-wall and high-gloss parts.
Environmental Reliability
Cold aging, damp heat and thermal shock tests verify the long-term stability of molded and structural parts under harsh conditions.
Cosmetic & Fit Validation
For consumer wearables, glossy surfaces, silk-screening, coating adhesion, surface abrasion and assembly fits are inspected across multiple dimensions.
Molding & Injection Test Equipment
SMT Quality
SPI/AOI inline inspection · X-ray joint check · PCBA testing · Product reliability
UDD has established an end-to-end quality management system covering incoming inspection - SMT placement - DIP insertion & post-soldering - unit assembly - finished product testing - outgoing inspection, supported by automated inspection equipment and a reliability laboratory to keep quality controllable across the whole process and traceable by batch.
Inline Inspection
SPI solder-paste inspection plus AOI optical check form a dual defense that intercepts placement defects in real time to protect first-pass yield.
Joint Inspection
X-ray imaging inspects hidden joints of BGA and POP packages, keeping voiding and bridging quantified and under control.
PCBA Testing
Functional and RF performance testing cover electrical specs; defective boards are located fast and closed out through rework.
Product Reliability
Whole-device aging, IP waterproofing and thermal cycling validate long-term quality under real usage scenarios.
Reliability Test Equipment
