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SMT Advantages
01005 · POP Stacking · 0.25mm-pitch BGA · QFN High-precision Mounting
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High-density, High-precision Mounting Capability
UDD has mounting capability for 01005 micro packages, POP stacking, 0.25mm-pitch fine-pitch BGA and QFN devices, combined with high-precision stencil printing and nitrogen reflow to meet the trend toward smaller, higher-density electronics.
01005 & QFN
High-precision mounting of 01005 micro components and QFN quad flat no-lead packages for ultra-miniature modules.
POP & BGA
POP stacking and 0.25mm-pitch fine-pitch BGA mounting, supporting high-integration chip stacking.
SPI/AOI Quality Control
SPI solder paste inspection and AOI automatic optical inspection cover all processes to secure solder joint quality for high-precision mounting.
Process Validation
First-article validation and X-RAY sampling for fine-pitch devices ensure mounting position and solder joint reliability.
