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SMT Surface Mount & PCBA
German Siemens dual-rail line, 10M+ SMT pieces/year, 8M+ terminals assembled
Production Equipment
UDD deploys multiple German Siemens fully automatic high-speed dual-rail SMT lines, paired with automatic board loaders, automatic solder paste printers, ten-zone reflow and nitrogen reflow ovens, plus AOI and SPI optical inspection, automatic dispensing and automatic screw driving, with a full-process MES system for traceable capacity and quality control.
Siemens Dual-rail Line
German Siemens fully automatic high-speed dual-rail line with automatic loading and solder paste printing
Reflow & Inspection
Ten-zone and nitrogen reflow, with AOI and SPI inspection throughout
MES Control
MES system for full traceability, with automatic dispensing and screw driving
Core Process
Supporting 01005 micro components, POP stacking, 0.25mm-pitch BGA, QFN and integrated modules to meet the high-density mounting needs of 5G communications, smart terminals and automotive electronics.
High-density Packaging
01005 micro components, 0.25mm-pitch BGA and QFN mounting capability
Stacking & Integration
POP stacking and integrated module processes for complex products
PCBA Test Line
The PCBA test line is built from 30 CMW500 comprehensive testers, 20 LitePoint 5G testers, 10 Anritsu 8870A units and 40 automatic shielded boxes, plus a DIP wave-soldering line and IP waterproof sealing tests (0~34kpa / 0~680kpa, IPX7-5m, 5ATM immersion leak test) to ensure outgoing quality and reliability.
